A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from November 15th to November 21st, 2024
1. Source: EDN – Application Processors Optimize Industrial Control
Date: November 15, 2024
Keywords: Industrial Control, Application Processors, Performance Optimization
Impacted Products: Processors, i.MX 94
Manufacturers: NXP
Summary: NXP’s i.MX 94 family of processors integrates communications, security and real-time control for industrial and in-vehicle applications. It has a multi-core architecture, supports post-quantum encryption and is compliant with security standards. Samples are expected to be available in the first quarter of 2025.
2. Source: TrendForce – TSMC to Build 10 Global Facilities in 2025
Date: November 18, 2024
Keywords: TSMC, Global Facilities, Capital Expenditure
Impacted Products: Semiconductors
Manufacturers: TSMC
Summary: TSMC announces a significant expansion with plans to construct 10 new global facilities in 2025, reflecting an increase in capital expenditures to nearly historical highs. This expansion is geared towards meeting the increasing global semiconductor demand, enhancing TSMC’s production capacity, and supporting various industries including consumer electronics and automotive with advanced semiconductor technologies.
3. Source: EE Times – Tower Photonics Innovation
Date: November 18, 2024
Keywords: Tower Semiconductor, Silicon Photonics, High-Speed Communication
Impacted Products: Silicon Photonics Devices
Manufacturers: Tower Semiconductor
Summary: Tower Semiconductor is expanding its market presence by embracing silicon photonics technology, which integrates optical and electronic functionalities to provide superior data transmission rates. This strategic pivot helps address the growing demands for high-speed communications infrastructure and supports developments in data centers and high-performance computing environments.
4. Source: BISinfotech – Microchip and Nvidia Edge AI
Date: November 18, 2024
Keywords: Microchip, Nvidia, Edge AI
Impacted Products: AI Processors
Manufacturers: Microchip, Nvidia
Summary: In a strategic collaboration, Microchip Technology and Nvidia are enhancing AI processing capabilities at the edge using Nvidia’s Holoscan platform. This integration aims to revolutionize real-time data processing and automation across various industries, enhancing the capabilities of edge devices in handling complex AI tasks efficiently and reliably.
5. Source: Embedded – Würth LoRaWAN Module
Date: November 19, 2024
Keywords: Würth Elektronik, LoRaWAN, Wireless Module
Impacted Products: Radio Modules
Manufacturers: Würth Elektronik
Summary: Würth Elektronik has introduced a new radio module designed for enhanced IoT connectivity using the LoRaWAN protocol, which offers significant improvements in terms of range and power efficiency. This module is particularly suited for applications requiring long-range connectivity with minimal power usage, facilitating advances in smart city, agriculture, and environmental monitoring technologies.
6. Source: Embedded – Infineon and Quantinuum Quantum Advance
Date: November 19, 2024
Keywords: Infineon, Quantinuum, Quantum Computing
Impacted Products: Quantum Computing Hardware
Manufacturers: Infineon, Quantinuum
Summary: Infineon and Quantinuum are joining forces to accelerate the practical application of quantum computing. Their collaboration focuses on enhancing quantum hardware integration and performance, aiming to transform how quantum computing can be applied in real-world industrial and technological scenarios, thus pushing the boundaries of computing technology.
7. Source: Electronics Weekly – 1mm Inductors Carry 480mA for Power Filters
Date: November 19, 2024
Keywords: Inductors, Power Filters, Miniaturization
Impacted Products: Inductors
Manufacturers: TDK
Summary: TDK has introduced a new 1 mm inductor designed for power supply filtering applications, capable of carrying 480mA of current. This development marks an important step in component miniaturisation, providing an efficient solution for space-constrained applications while ensuring reliable performance in power management.
8. Source: BISinfotech -Infineon PROFET eFuse
Date: November 20, 2024
Keywords: Infineon, PROFET, eFuse Protection
Impacted Products: PROFET Wire Guard Components
Manufacturers: Infineon
Summary: Infineon has released a new PROFET Wire Guard component featuring built-in eFuse protection, aimed at enhancing electrical safety in automotive and industrial applications. This product addresses critical safety concerns by preventing overcurrent and overvoltage issues, thus improving overall system reliability and protection.
9. Source: Electronics Weekly – Electronic Components Update
Date: November 20, 2024
Keywords: Electronic Components, Processor, LX2160-Space
Impacted Products: processor
Manufacturers: Teledyne
Summary: Teledyne e2v introduces the LX2160-Space processor, based on the 16-core Arm Cortex-A72 for satellite communications and space computing missions, delivering 200k DMIPS of performance and 2W of power per core. multiple space-grade versions are expected to be available in the first half of 2025.
10. Source: TrendForce – Memory Spot Price Update: DDR4, DDR5
Date: November 20, 2024
Keywords: Memory Prices, DDR4, DDR5
Impacted Products: Memory Modules
Manufacturers: —
Summary: The latest analysis on memory spot prices reveals a moderation in the price decline for DDR4 and DDR5 modules, despite persisting weak demand. This report provides a detailed look at the market dynamics affecting memory prices, offering insights into potential future trends and the challenges facing the memory industry as it navigates through market adjustments and demand fluctuations.
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