A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from September 5, 2025 to September 11, 2025.
1.Title: Broadcom Secures $10B Custom AI Chip Order, Lifts 2026 AI Sales Forecast
Date: September 5, 2025
Summary: Broadcom secured a $10 billion custom AI chip order from a new client, raising its 2026 AI sales forecast and expecting strong shipments from 2026 onward.
Key Details:
Keywords: Broadcom, custom AI chip, $10 billion order, 2026 shipments, AI sales forecast
Manufacturers: Broadcom
Impacted Products: Custom XPUs (AI chips) and related CoWoS packaging
Insight:
Major client adoption boosts Broadcom’s AI chip visibility and momentum, signaling potential expansion of tailored AI ASIC demand among hyperscalers.
2.Title: Intel Eyes 2026 as Crucial 14A Test Year, May Rely on TSMC Permanently
Date: September 5, 2025
Summary: Intel views 2026 as a pivotal year to test its 14A process technology, though it may remain reliant on TSMC indefinitely if external commitments fall short.
Key Details:
Keywords: Intel, 14A process, pivotal 2026, TSMC outsourcing, external foundries
Manufacturers: Intel, TSMC
Impacted Products: Intel’s fabrication roadmap—14A node, potential dependency on external foundries
Insight:
Failure to secure external customers for 14A may push Intel into prolonged TSMC dependence, affecting its foundry autonomy and strategic roadmap.
3.Title: SK hynix Likely to Secure NVIDIA HBM4 Deal by September, Samsung Trails in Testing
Date: September 8, 2025
Summary: SK hynix may secure an HBM4 deal with NVIDIA by September, while Samsung reportedly trails behind in testing stages.
Key Details:
Keywords: SK hynix, NVIDIA, HBM4, testing, memory competition
Manufacturers: SK hynix, Samsung
Impacted Products: HBM4 memory modules for AI accelerators (NVIDIA GPUs)
Insight:
SK hynix is moving ahead in the HBM4 memory race, positioning itself as NVIDIA’s likely supplier while Samsung lags in validation.
4.Title: Andes Announces D23-SE Functional-Safety RISC-V Core for ASIL-B/D Applications
Date: September 8, 2025
Summary: Andes has introduced the D23-SE functional-safety RISC-V core, meeting ASIL-B/D standards with Dual-Core Lockstep and Split-Lock modes, facilitating ISO 26262 compliance and reducing time to market.
Key Details:
Keywords: Andes Technology, D23-SE core, RISC-V, functional safety, ASIL-B/D, Dual-Core Lockstep, Split-Lock, ISO 26262
Manufacturers: Andes Technology
Impacted Products: RISC-V processor IP cores targeting automotive and industrial functional safety systems
Insight:
Safety-centric dual-mode design empowers developers to balance performance and compliance—boosting ISO 26262 paths and speeding ASIL-targeted deployments.
5.Title: SiFive Introduces Intelligence XM Series to Accelerate AI Workloads
Date: September 8, 2025
Summary: SiFive has launched the Intelligence XM series of AI acceleration cores integrating scalar, vector, and matrix engines per cluster—enabling high-bandwidth, energy-efficient AI compute.
Key Details:
Keywords: Intelligence XM series, AI acceleration, RISC-V, scalar-vector-matrix engines
Manufacturers: SiFive
Impacted Products: RISC-V IP cores for AI inference/acceleration in edge devices, autonomous vehicles, data centers
Insight:
Integrating multi-engine architecture delivers scalable, energy-efficient AI compute, strengthening RISC-V’s role in next-gen intelligent SoCs.
6.Title: Kyocera-AVX Introduces Mini BME-Stacked X7R High-CV Capacitors (DSCC 25007)
Date: September 9, 2025
Summary: Kyocera-AVX launched the DSCC 25007 mini BME-stacked X7R high-CV capacitors in 2220 format, fully traceable with 100 % Group A testing—targeting aerospace and military circuits.
Key Details:
Keywords: Kyocera-AVX, DSCC 25007, high CV, Group A testing, aerospace, military
Manufacturers: Kyocera-AVX
Impacted Products: High-CV mini stacked MLCCs used in PCBs for satellite, missile, aircraft, and high-reliability power systems
Insight:
Compact, fully tested capacitors enhance high-CV PCB design efficiency—ideal for vibration-prone, high-reliability aerospace and defense electronics.
7.Title: AMD May Return to GPU Arena with the Launch of 2.5D/3.5D Chiplet-Based GPU
Date: September 9, 2025
Summary: AMD is developing next-generation GPUs (Navi4x/Navi5x) with advanced 2.5D/3.5D chiplet packaging to enhance interconnect bandwidth and power efficiency, signaling a comeback in high-performance graphics.
Key Details:
Keywords: AMD, GPU, Navi4x, Navi5x, 2.5D packaging, chiplet, interconnect bandwidth, power efficiency
Manufacturers: AMD
Impacted Products: Next-generation Radeon and Instinct (consumer and data center GPUs) using Navi4x/Navi5x architectures
Insight:
Multi-chiplet GPU design revives AMD’s high-end competitiveness by balancing cost and performance—ideal for compute-intensive and data center markets.
8.Title: ROHM Unveils LMR1901YG-M Ultra-Low-Current Op-Amp for Extended Battery-Powered Operation
Date: September 9, 2025
Summary: ROHM unveiled the LMR1901YG-M ultra-low-current op-amp drawing only 160 nA (typ.), with a maximum input offset of 0.55 mV and stable operation across –40 °C to +105 °C, extending battery-powered device runtime.
Key Details:
Keywords: LMR1901YG-M, op-amp, ultra-low current, high accuracy, temperature stability, sensor amplification
Manufacturers: ROHM
Impacted Products: Ultra-low-power op-amps for sensor signal amplification in battery-powered and temperature-variable applications
Insight:
Extremely low consumption and stability enhance sensor-based device endurance—boosting performance in always-on, battery-dependent applications.
9.Title: Memory Spot Price Update: SanDisk’s 10% Price Hike Meets Demand-Side Resistance
Date: September 10, 2025
Summary: SanDisk rolled out a 10% NAND price increase, but weak demand is blocking adoption by channel and retail; DDR4 spot prices rose spurred by strong revenue from Nanya, yet buyer resistance limits broad uptake.
Key Details:
Keywords: NAND Flash, SanDisk, DRAM (DDR4,DDR5), Spot Price
Manufacturers: SanDisk, Nanya Technology
Impacted Products: NAND Flash (specifically 512Gb TLC wafers), DRAM (DDR4 mainstream chips
Insight:
Price hikes in memory face a ceiling without demand support — channel resistance limits gains despite vendor cost pressures.
10.Title: SK hynix Partners with Naver Cloud to Test CXL, PIM Memory Tech, Reportedly Eyes Major CSPs
Date: September 11, 2025
Summary: SK hynix partners with Naver Cloud to test CXL and PIM in real-world data centers, aiming to vie for orders from major cloud service providers like AWS, Microsoft, and Google.
Key Details:
Keywords: Naver Cloud, CXL, PIM, AI memory, Cloud Service Providers (CSPs)
Manufacturers: SK hynix
Impacted Products: Next-generation AI memory solutions using CXL and PIM technologies
Insight:
SK hynix is pushing forward with CXL/PIM to secure cloud-scale adoption, betting efficiency gains will drive demand among CSPs.
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