1. Product Overview
The RFPA0133TR7 is a high-efficiency, programmable-gain RF power amplifier based on GaAs HBT technology, developed by RF Micro Devices (now part of Qorvo). It supports a supply voltage range of 3V to 5V and operates across a wide frequency band from 380 MHz to 960 MHz, with typical applications concentrated in ISM and industrial wireless bands such as 400 MHz, 868 MHz, and 915 MHz. Common use cases include industrial remote control, 900 MHz ISM communications, and analog wireless systems. With excellent small-signal gain, saturated efficiency, and flexible output control, this device is well-suited for use as a driver or main PA in mid-power RF chains.
2. Key Specifications
Parameter | Typical Value (Unit) | Description |
Operating Frequency | 380 – 960 MHz | Supports ISM/industrial bands (400/868/915 MHz) |
Max Output Power | 30 dBm | Tested under CW conditions at VCC = 5V |
Small-Signal Gain | 32 dB | Measured at 900 MHz |
Saturated Efficiency | >60% | Typical, PIN = 0 dBm, VCC = 5V |
Supply Voltage Range | 3.0 – 5.0 V | 5V recommended for full output |
Max Supply Current | 230 mA | G16/G8 set to High |
Idle Current | 75 mA | No RF input applied |
Operating Temperature | –40°C to +85°C | Industrial-grade specification |
Package | QFN 3×3 mm (16-lead) | Exposed pad, JEDEC-compliant reflow compatible |
3. Operating Principles and Performance Advantages
The RFPA0133TR7 integrates a three-stage amplifier architecture and supports four programmable output levels via digital control inputs G16 and G8, offering typical output powers of approximately 5, 16, 23, and 30 dBm. Its collector output topology provides high power density and effective thermal performance for compact wireless modules.
Key Advantages:
- High Efficiency:>60% PAE at full output, ideal for power-sensitive designs
- Digital Output Control: Supports 8 dB and 16 dB gain steps via G16/G8 logic
- Wideband Operation: Covers 400–900 MHz for common ISM and industrial use
- High Integration: Internal bias control and compact footprint ease board design
- Thermal Robustness: Junction-to-board thermal resistance as low as 60 °C/W under typical load
4. Design and Debugging Guide
To ensure stable and efficient performance, the following best practices are recommended:
Power and Control:
- Use a regulated 5V supply; keep VPD, VBIAS, G16, and G8 control inputs ≤3.3V (recommended 3.0V)
- Apply local high-frequency bypass capacitors (e.g., 100 pF) on all control lines to suppress digital noise coupling
RF Matching and Layout:
- The final stage collector output is unmatched; external matching to 50Ω is required
- Qorvo provides typical matching networks in evaluation board schematics
- Maintain short, symmetrical RF traces and isolate from digital noise sources
Thermal Management:
- The QFN exposed pad must be soldered to a large ground plane
- Use thermal vias under the pad to enhance heat dissipation in high-power designs
- Ensure wide, low-impedance copper routing for supply paths
Common Issues and Troubleshooting:
Symptom | Possible Cause | Recommended Action |
No output / low power | Improper logic level on G16/G8 | Ensure logic ≥1.7V and good ground connection |
Excessive current draw | Mismatched load or overvoltage | Verify impedance match and keep VCC ≤5.25V |
High harmonic emissions | Inadequate filtering in output network | Add LC trap or ceramic low-pass filter |
Overheating | Poor thermal grounding or layout | Improve pad soldering, use vias and copper fill |
5. Related Product Comparison
To support multi-band systems or expand design flexibility, the following Qorvo products share similar packages and power classes:
Part Number | Frequency Range | Package | Target Application |
RFPA0133TR7 | 860–930 MHz | QFN 3×3 mm | ISM modules, industrial control, RFID |
824–849 MHz | QFN 3×3 mm | LTE/CDMA Band 5 uplink PA | |
700–1000 MHz | QFN 3×3 mm | WCDMA/LTE mid-band driver or PA |
All devices above share package compatibility for modular RF front-end design.
6. Packaging and Reference Resources
The RFPA0133TR7 is offered in a 3×3 mm QFN package with 16 leads and an exposed thermal pad, compliant with JEDEC standard reflow soldering processes. RFMD (now Qorvo) provides complete evaluation boards for both 430 MHz and 860–930 MHz bands, along with reference schematics and thermal characterization data. WIN SOURCE offers in-stock availability of this device, along with packaging documentation and verified symbol/footprint libraries to support rapid design integration.
Designed for 380–960 MHz communication systems, this high-efficiency, digitally controlled RF power amplifier is particularly well-suited for ISM and industrial wireless applications. With high power density, flexible supply voltage, and robust thermal performance, the RFPA0133TR7 offers an ideal solution for compact wireless modules requiring mid-power amplification.
To explore more component specifications, packaging models, and inventory availability, please visit the official WIN SOURCE website.
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