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    * Question

    Chip package


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    Answer

    1.BGA ball grid array package

    2.CSP chip scale package

    3.COB board chip mounting

    4.Chip mounting on COC ceramic substrate

    5.MCM multi-chip model placement

    6.LCC leadless chip carrier

    7.CFP ceramic flat package

    8.PQFP plastic four-lead package

    9.SOJ plastic J-line package

    10.SOP smallPlastic molding

    19.WLCSP wafer level chip scale package

    20.Flip chip on FCOB board


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