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  • Weekly Industry News Digest from Win Source – From September 12, 2025 to September 18, 2025

    A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from September 12, 2025 to September 18, 2025.

    1.Title: Micron Freezes Prices Amid Surging Inference-AI Demand and Storage Supply Shortages
    Date: September 12, 2025
    Summary: Micron freezes all product pricing, citing surging inference-AI demand for SSDs and NAND/DRAM and looming supply shortages, while it reassesses its pricing strategy.
    Key Details: 
    Keywords: SSD demand, inference AI, NAND supply, DRAM pricing freeze
    Manufacturers: Micron
    Impacted Products: Solid-state drives (SSDs), NAND Flash, DRAM
    Insight:  
    Inference-AI demand is shifting storage markets, forcing price freezes as manufacturers scramble to close the supply-demand gap.                    

    2.Title: Samsung Expands 1c DRAM Capacity for HBM4, Targeting 60,000 Wafers/Month in 2025
    Date: September 12, 2025
    Summary: Samsung is scaling up 1c DRAM capacity at its Pyeongtaek P4 and Hwaseong sites, aiming for 60,000 wafers/month by 2025 to lead in the HBM4 marketplace.
    Key Details:
    Keywords: 1c DRAM, HBM4, DRAM capacity
    Manufacturers: Samsung Electronics
    Impacted Products: 1c DRAM chips, HBM4 high-bandwidth memory modules
    Insight:   
    Investing in advanced DRAM (1c) gives Samsung a chance to leapfrog competitors in the HBM4 memory race.                                         

    3.Title: Mitsubishi Electric Launches Compact DIPIPM Power Modules: 30A & 50A / 600V Samples from September
    Date: September 15, 2025
    Summary: Mitsubishi Electric introduces compact Compact DIPIPM modules PSS30SF1F6 (30A/600V) and PSS50SF1F6 (50A/600V), with samples shipping starting September 22, 2025.
    Key Details:
    Keywords: Mitsubishi Electric, DIPIPM, power semiconductor module, compact
    Manufacturers: Mitsubishi Electric
    Impacted Products: Power semiconductor modules, DIPIPM series (Dual Inline Package Intelligent Power Module)
    Insight:   
    Smaller footprint and high current rating in DIPIPM modules cater to space-sensitive industries like consumer appliances and HVAC systems.                           

    4.Title: Silver Lake Buys Majority Stake in Altera, Altera Emerges as Top Independent FPGA Player
    Date: September 15, 2025
    Summary: Private equity firm Silver Lake acquires 51% of Intel’s Altera business for approximately US$8.75B, establishing Altera as a leading independent FPGA provider.
    Key Details:
    Keywords: Altera acquisition, FPGA, Intel, programmable logic, US$8.75B
    Manufacturers: Silver Lake, Intel, Altera
    Impacted Products: FPGA devices, programmable logic devices, embedded systems using Altera platforms
    Insight:   
    This acquisition allows Altera to operate independently, sharpening FPGA market competition and innovation under Silver Lake’s strategy.

    5.Title: Bourns Introduces SDE0403AT Automotive-Grade SMD Power Inductors for High-Temperature Applications
    Date: September 16, 2025
    Summary: Bourns launches the SDE0403AT series automotive-grade SMD power inductors: up to 4.8A saturation, ≤3.5mm thickness, −55°C to +150°C, AEC-Q200 certified.
    Key Details:
    Keywords: SDE0403AT, automotive grade, AEC-Q200, power inductors
    Manufacturers: Bourns Inc.
    Impacted Products: power filtering, DC power lines in vehicles, high temp power supply circuits
    Insight:   
    AEC-Q200 certified inductors with high temp resilience target rising automotive power demands.

    6.Title: Microchip Power Module Portfolio with IGBT7 Technology Targets High-Density Power Conversion
    Date: September 16, 2025
    Summary: Microchip launches IGBT7 power modules (1,200–1,700V, 50–900A) for motor drives, EVs, renewables, and high-density power conversion.
    Key Details:
    Keywords: IGBT7, power modules, high power density, EVs, renewable energy
    Manufacturers: Microchip Technology Inc.
    Impacted Products: High-voltage IGBT7 modules, power conversion systems, industrial motor drives
    Insight:
    IGBT7 modules increase power density and efficiency, crucial for electrification and sustainable energy application.                                                                     

    7.Title: TDK-Lambda Introduces 1,200W Compact, Low-Noise AC-DC Supply for Medical & Industrial Systems
    Date: September 17, 2025
    Summary: TDK-Lambda launches a 1,200W AC-DC power supply with 95% efficiency, compact size and low audible noise, aimed at medical and industrial high-power density applications.
    Key Details:
    Keywords: 1200W AC-DC, high efficiency, low noise, medical power supply
    Manufacturers: TDK (TDK-Lambda)
    Impacted Products: Power supply units, medical devices, industrial automation
    Insight: 
    Growing demand for compact, efficient, and quiet AC-DC supplies in medical/industrial equipment pushes power supply innovation.

    8.Title: SanDisk Reports NAND Shortage to Persist Until 2026, Price Opportunities Broadening
    Date: September 17, 2025
    Summary: SanDisk and other NAND Flash manufacturers’ production cuts worsen supply shortages, with NAND price increases expected to persist through 2026.
    Key Details:
    Keywords: NAND Flash, supply shortage, price rebound, production cuts
    Manufacturers: SanDisk
    Impacted Products: NAND Flash, eMMC/UFS components
    Insight:   
    As NAND supply tightens, manufacturers shift focus to higher-margin segments, pricing power returns for NAND suppliers.

    9.Title: STMicroelectronics to Invest $60 Million in PLP Pilot Line at Tours Plant for Q3 2026 Launch
    Date: September 17, 2025
    Summary: STMicroelectronics invests US$60M in its Tours, France plant for a pilot Panel-Level Packaging (PLP) line, scheduled to begin operations in Q3 2026 to enhance packaging efficiency.
    Key Details: 
    Keywords: PLP, Tours, packaging, pilot line, chip packaging innovation
    Manufacturers: STMicroelectronics
    Impacted Products: Packaged ICs, semiconductors benefiting from advanced packaging
    Insight: 
    PLP investment reflects trend toward high-density packaging to reduce cost, improve throughput, and accommodate advanced chip scaling.

    10.Title: Intel Rumored to Build Gaudi-3 Chips for Tesla on 18A Process, Early Dell Server Adoption Signals Momentum
    Date: September 18, 2025
    Summary: Intel is rumored to manufacture Gaudi-3 AI accelerators for Tesla using its 18A process, while Dell servers show early adoption, indicating expansion in AI accelerator markets.
    Key Details:
    Keywords: Gaudi-3, 18A process, Tesla, Dell servers, AI accelerator, foundry services
    Manufacturers: Intel, Tesla, Dell
    Impacted Products: AI accelerators (Gaudi-3), inference-optimized chips, servers equipped with Gaudi-3
    Insight:   
    Intel’s 18A foundry work for Gaudi-3 and OEM adoption suggests growing competition in inference AI chip supply.

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