A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from August 29, 2025 to September 4, 2025.
1.Title: SMIC H1 2025 Net Profit Jumps 35.6%, 7nm Capacity Expansion Set for 2026
Date: August 29, 2025
Summary: SMIC’s H1 2025 net profit surged 35.6% YoY, driven by strong semiconductor wafer foundry business, with 7nm advanced chip capacity set to double in 2026.
Key Details:
Keywords: 2025 net profit, 35.6% growth, 7nm process
Manufacturers: Semiconductor Manufacturing International Corp (SMIC).
Impacted Products: 7nm process node wafers and related chips.
Insight:
Doubling 7nm output in 2026 will significantly bolster China’s domestic semiconductor supply chain ambitions.
2.Title: Broadcom Boosts 2026 CoWoS Orders with Foundries on Strong AI Chip Demand
Date: August 29 , 2025
Summary: Broadcom significantly increases 2026 CoWoS orders due to booming AI chip demand, benefiting foundries like TSMC and driving advanced packaging capacity expansion.
Key Details:
Keywords: CoWoS, advanced packaging, AI chips, ASIC
Manufacturers: Broadcom, TSMC
Impacted Products: AI accelerators, high-performance ASICs, CoWoS-packed semiconductors
Insight:
Surging AI-driven ASIC demand pushes Broadcom to secure more CoWoS capacity from TSMC, accelerating global AI chip supply chain growth in 2026.
3.Title: Rapidus 2HP Logic Density Matches TSMC N2, Surpasses Intel 18A Amid BSPDN Impact
Date: September 1, 2025
Summary: Japan’s Rapidus 2nm logic density rivals TSMC N2, surpasses Intel 18A impacted by BSPDN, with mass production planned for 2027.
Key Details:
Keywords: 2nm process, logic density, TSMC N2, Intel 18A
Manufacturers: Rapidus, TSMC, Intel
Impacted Products: High-performance computing (HPC) chips, AI accelerators
Insight:
Rapidus’s 2HP (237.31 MTr/mm²) rivals TSMC N2 in density, outperforms Intel 18A (184.21 MTr/mm²) due to BSPDN trade-offs, intensifying advanced foundry competition by 2027.
4.Title: Backend Semiconductor Equipment Market to Reach $9.2B by 2030 on Advanced Packaging Demand
Date: September 1, 2025
Summary: Backend semiconductor equipment market to hit $9.2B by 2030, driven by advanced packaging demand with TCB systems growing at 11.6% CAGR, fueled by AI/HPC needs.
Key Details:
Keywords: HBM, thermocompression bonding, hybrid bonding, CAGR
Manufacturers: Hanmi, ASMPT, BESI, SET, Shibaura
Impacted Products: hybrid bonding tools, flip-chip bonders, wafer thinning equipment, HBM stacks
Insight:
AI/HPC demand drives backend equipment growth to $9.2B by 2030, with TCB and hybrid bonding expanding at 11.6% CAGR as advanced packaging requires front-end precision.
5.Title: TRACO POWER Expands Portfolio with Cost-Efficient 40W THL-40WI Series DC-DC Converters
Date: September 1, 2025
Summary: TRACO POWER launches cost-efficient 40W DC-DC converters meeting industrial EMC standards for automation and control applications.
Keywords: TRACO POWER, DC-DC converters, 40W power modules
Manufacturers: TRACO Power AG
Impacted Products: Industrial power supplies, DC-DC converters, Cost-sensitive industrial equipment
Insight:
TRACO’s new 40W converters meet industrial EMC standards at competitive pricing, expanding options for cost-sensitive automation and control applications while maintaining reliability.
6.Title: GlobalFoundries Unveils 22FDX+ RRAM Technology for AI and Wireless Applications
Date: September 2, 2025
Summary: GlobalFoundries introduces 22FDX+ RRAM technology for AI/wireless apps, offering low-power, secure embedded memory for edge computing, with volume production slated for 2026.
Key Details:
Keywords: GlobalFoundries, 22FDX+, RRAM (Resistive RAM), AI, IoT
Manufacturers: GlobalFoundries , Nordic Semiconductor
Impacted Products: Wireless microcontrollers, AI IoT chips, edge AI sensors
Insight:
GF’s 22FDX+ RRAM combines low-power, high-density memory with secure on-chip storage for AI edge devices, targeting volume production in 2026 to address growing demand for efficient. 7.Title: Toshiba Launches 650V SiC MOSFETs in TOLL Package with Low On-Resistance and Integrated Schottky
Date: September 2, 2025
Summary: Toshiba’s 650V SiC MOSFETs in TOLL package feature 27mΩ Rds(on), reducing switching losses by 55% for higher efficiency in industrial power systems.
Key Details:
Keywords: Toshiba, 650V SiC MOSFET, TOLL package, Kelvin connection, switching loss
Manufacturers: Toshiba, Infineon
Impacted Products: Industrial power supplies, motor drives, solar inverters, high-frequency power converters
Insight:
Toshiba’s TOLL-packaged SiC MOSFETs reduce switching losses by 55% (turn-on) and 25% (turn-off) versus TO-247, enabling higher efficiency in compact industrial power systems.
8.Title: ABLIC Introduces S-19230-1 Series Ultra-Low Current Automotive Voltage Regulator with 80V Tolerance
Date: September 2, 2025
Summary: ABLIC launches S-19230 automotive voltage regulators with 80V tolerance and 7μA ultra-low current, meeting ASIL-D safety for xEV systems.
Key Details:
Keywords: ABLIC, Automotive voltage regulator, Ultra-low current, 80V tolerance, Functional safety
Manufacturers: ABLIC Inc.
Impacted Products: Automotive ECUs, Body control modules, Sensor systems, xEV powertrain components
Insight:
This 7μA ultra-low Iq regulator with 80V surge protection meets ASIL-D functional safety needs for xEV systems while reducing standby power in always-on automotive applications.
9.Title:SK Hynix Leads Industry to Adopt ASML’s High-NA EUV System for Advanced Memory Production
Date: September 3, 2025
Summary: SK Hynix pioneers High-NA EUV for memory production, enabling 1.7x smaller transistors and 2.9x density gain, boosting AI and high-performance DRAM advancement.
Key Details:
Keywords: SK Hynix, High-NA EUV, ASML, DRAM, memory scaling, transistor density, lithography
Manufacturers: SK Hynix, ASML
Impacted Products: Next-generation DRAM, AI memory chips46, high-performance computing (HPC) semiconductors
Insight:
SK Hynix’s High-NA EUV adoption enables 1.7x smaller transistors and 2.9x higher density vs. prior EUV, accelerating AI memory innovation and scaling for HPC demands.
10.Title: Samsung to Use Exynos 2600 in Base & Edge S26 Models, Reducing Qualcomm Reliance
Date: September 4, 2025
Summary: Samsung plans to equip base and Edge Galaxy S26 models with its in-house Exynos 2600 processor, while the Ultra will retain Qualcomm’s Snapdragon, reducing reliance on Qualcomm.
Key Details:
Keywords: Samsung Exynos 2600,Galaxy S26,2 nm GAA process
Manufacturers: Samsung
Impacted Products: Galaxy S26 (base),Galaxy S26 Edge,Galaxy S26 Ultra
Insight:
By deploying Exynos 2600 in select Galaxy S26 models, Samsung strengthens in-house chipmaking, cuts costs, and tests its next-gen 2 nm strategy—bearing major implications for its semiconductor future.
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