Weekly Industry News Digest from Win Source – From August 30th to September 5th, 2024

A comprehensive overview of the current state of affairs in the electronic components industry is presented,highlighting notable developments and emerging trends from August 30th to September 5th, 2024

1. Source: BIS Infotech – Vishay’s New ESD Diode
Date: August 30, 2024
Keywords: Vishay, ESD Diode, Automotive Ethernet
Impacted Products: Diodes
Manufacturers: Vishay
Summary: Vishay has launched a compact ESD diode tailored for automotive Ethernet applications, designed to significantly improve the reliability and safety of vehicle network systems by providing enhanced electrostatic discharge protection.

2.Source: TrendForce – Intel’s Foundry Business
Date: August 30, 2024
Keywords: Intel, Foundry Spin-Off, Merger
Impacted Products: —
Manufacturers: Intel
Summary: Intel is evaluating strategic alternatives for its foundry services, including potential spin-offs or mergers. This move aims to mitigate financial losses and refocus on core business strengths, potentially reshaping its position in the global semiconductor market.

3.Source: Embedded.com – Efficient & GlobalFoundries Pact
Date: September 1, 2024
Keywords: Efficient, GlobalFoundries, Agreement
Impacted Products: Semiconductor
Manufacturers: Efficient, GlobalFoundries
Summary: Efficient has formalized a collaboration with Global Foundries to enhance its semiconductor manufacturing capabilities. This partnership will focus on deploying cutting-edge manufacturing technologies and fostering innovation in semiconductor production, aligning with industry demands for higher efficiency and performance.

4.Source: All About Circuits – VHDL to Hardware FSM
Date: September 2, 2024
Keywords: VHDL, Hardware Design, Finite State Machine
Impacted Products: FPGA
Manufacturers: —
Summary: This feature explores the transition from VHDL code to practical hardware implementations, concentrating on the design and efficiency of finite state machines. This advancement is crucial for developers aiming to optimize hardware functionality and reliability in various electronic applications.

5.Source: BIS Infotech – Rohde & Schwarz at EuMW 2024
Date: September 3, 2024
Keywords: Rohde & Schwarz, RF Microwave Solutions, EuMW 2024
Impacted Products: RF Microwave
Manufacturers: Rohde & Schwarz
Summary: Rohde & Schwarz showcased their latest innovations in RF and microwave solutions at EuMW 2024, focusing on next-generation wireless communication and radar technologies. These developments promise to advance the capabilities of RF systems in terms of range, accuracy, and versatility.

6.Source: Power Electronics News – Wise Integration in China
Date: September 3, 2024
Keywords: Wise Integration, China, Subsidiary
Impacted Products: —
Manufacturers: Wise Integration
Summary: Wise Integration has strategically established a subsidiary in China to facilitate the development of its Asian business sector and stimulate growth within the regional markets. This move underscores Wise Integration’s commitment to expanding its global footprint and enhancing service delivery to meet regional demands.

7.Source: Embedded.com – CoreHW & Presto Engineering
Date: September 4, 2024
Keywords: CoreHW, Presto Engineering, RF IoT Devices
Impacted Products: RF
Manufacturers: CoreHW, Presto Engineering
Summary: CoreHW and Presto Engineering have embarked on a joint project to develop ultra-low power RF devices for the IoT industry. Their collaboration aims to create highly efficient, reliable, and scalable solutions that will revolutionize how IoT devices communicate and operate, potentially setting new industry standards.

8.Source: ECINews – Chip Market Crisis in Europe
Date: September 4, 2024
Keywords: European Chip Market, Collapse
Impacted Products: —
Manufacturers: —
Summary: The European semiconductor market is facing a significant downturn, marked by reduced production and innovation delays. This market collapse raises substantial concerns about the supply chain stability and future growth of the semiconductor industry in Europe.

9.Source: TrendForce – SK Hynix’s AI Chip Strategy
Date: September 4, 2024
Keywords: SK Hynix, AI Chips, HBM
Impacted Products: AI Chips
Manufacturers: SK Hynix
Summary: SK Hynix is adjusting its design approach for AI chips, moving away from High Bandwidth Memory (HBM) for certain AI applications while continuing to leverage it in high-performance computing products. This strategic pivot reflects their ongoing commitment to optimizing memory solutions across different tech sectors.

10.Source: All About Circuits – Toshiba’s New Automotive Chip
Date: September 5, 2024
Keywords: Toshiba, CXPI Responder, Automotive Chip
Impacted Products: Chips
Manufacturers: Toshiba
Summary: Toshiba has released a new automotive CXPI responder interface chip, which includes built-in logic hardware to boost the efficiency and reliability of automotive communication systems. This innovation highlights Toshiba’s commitment to advancing automotive technology and supporting the development of more connected and intelligent vehicles.