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  • Weekly Industry News Digest from Win Source – From July 12th to July 18th, 2024

    A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from July 12th to July 18th, 2024

    1. Source: TrendForce – Memory Market Outlook

    Date: July 12, 2024

    Keywords: Memory Manufacturers, Market Trends

    Impacted Products: DRAM, NAND Flash

    Manufacturers: Samsung, SK Hynix, Micron

    Summary: Memory manufacturers anticipate growth in 2025 driven by increased demand for artificial intelligence applications. Improved market conditions and rising prices for DRAM and NAND Flash are expected to support this growth. Companies like Micron and Winbond project financial gains, with enterprise SSDs and high-bandwidth memory (HBM) seeing significant interest.

    2. Source: EETimes – Venture Fund for Silicon Startups

    Date: July 13, 2024

    Keywords: Silicon Startups, Venture Fund, Semiconductor

    Impacted Products: Semiconductor

    Manufacturers: —

    Summary: A dedicated venture fund aims to fuel innovation in the semiconductor field by providing significant financial backing specifically for silicon-based startups. This initiative is expected to catalyze developments and accelerate the commercialization of new semiconductor technologies.

    3. Source: TrendForce – ALD Tech Development

    Date: July 15, 2024

    Keywords: ALD Technology, EUV Process, Semiconductor

    Impacted Products: Semiconductor

    Manufacturers: Jusung Engineering

    Summary: A breakthrough in atomic layer deposition (ALD) technology by a Korean equipment manufacturer Jusung Engineering promises to decrease the industry’s dependence on extreme ultraviolet (EUV) lithography processes. This development could lower production costs and enhance the efficiency of semiconductor manufacturing lines.

    4. Source: TechInsights – Chip R&D Spending Insights

    Date: July 15, 2024

    Keywords: R&D Spending, Semiconductor, Americas

    Impacted Products: Semiconductor Devices

    Manufacturers: Intel, AMD, Qualcomm

    Summary: U.S. companies still account for 62 per cent of total R&D spending in the global semiconductor industry. Of this, Intel contributes 16 per cent ($16 billion).Six of the top 10 semiconductor R&D spending companies in the world in 2023 will be from the United States.

    5. Source: BISinfotech – Smart Cockpit by Infineon, MediaTek

    Date: July 16, 2024

    Keywords: Infineon, MediaTek, Smart Cockpit

    Impacted Products: CYT4DN MCU, Auto SoC

    Manufacturers: Infineon, MediaTek

    Summary: Infineon and MediaTek have partnered to develop an innovative vehicle smart cockpit solution that improves cost-effectiveness and technical capabilities. The system uses Infineon’s TRAVEO™ CYT4DN MCUs and MediaTek’s Tenguet Auto SoCs to create a reliable and efficient cockpit environment that complies with ASIL-B safety standards. The solution supports high-resolution displays and runs on the Android operating system, simplifying the software architecture and reducing costs.

    6. Source: All About Circuits – New Space Tech Devices

    Date: July 16, 2024

    Keywords: Rad-Hard Devices, Space Technology

    Impacted Products: JAN transistors,RAM,RF Modules

    Manufacturers: Microchip, Infineon, Qorvo

    Summary: Microchip, Infineon and Qorvo have joined forces to produce new radiation-resistant devices such as JAN transistors, RAMs and RF modules for space applications. The focus is on improving durability and performance under extreme environmental conditions. These devices will set new standards for reliability in space technology.

    7. Source: Power Electronics News – WBG Materials Innovation

    Date: July 16, 2024

    Keywords: WBG Materials, Semiconductor

    Impacted Products: Power Semiconductors, WBG

    Manufacturers: Nexperia

    Summary: Nexperia says wide bandgap materials are leading the way into the future of semiconductor research and manufacturing, with superior properties that can significantly improve the efficiency and performance of electronic devices. This focus is expected to drive significant technological advances in the next generation of semiconductor applications.

    8. Source: EETimes – Canada’s Semiconductor Boost

    Date: July 17, 2024

    Keywords: Canada, Semiconductor Investment

    Impacted Products: Semiconductor

    Manufacturers:  —

    Summary: Canada intensifies its focus on semiconductor technology by ramping up investments to fortify its position in the global tech landscape. This strategic move is aimed at fostering innovation, attracting talent, and building a sustainable competitive advantage in the semiconductor industry.

    9. Source: BISinfotech – VIAVI’s New Fiber Tech

    Date: July 17, 2024

    Keywords: VIAVI, Fiber Optic, Sensing Solutions

    Impacted Products: Fiber Optic Cables

    Manufacturers: VIAVI

    Summary: VIAVI Solutions Inc. has introduced NITRO® Fibre Optic Sensing, a new technology for real-time monitoring and analysis of critical infrastructure such as pipelines and data centers. The system includes Distributed Temperature Sensing (DTS), Synchronised Temperature and Strain Sensing (DTSS), and Distributed Acoustic Sensing (DAS), enabling operators to effectively detect and respond to threats, ultimately reducing operating costs and preventing downtime.

    10. Source:Embedded – NXP’s Digital Key Certification

    Date: July 17, 2024

    Keywords: NXP, Digital Key Certification

    Impacted Products: single-chip NFC, embedded security component

    Manufacturers: NXP

    Summary: NXP’s single-chip NFC and embedded security component solutions have received significant certification from the Car Connectivity Consortium, promising to revolutionize automotive access control and security systems. The certification underscores NXP’s commitment to advancing connected car technology and enhancing the user experience.

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