Weekly Industry News Digest from Win Source – From July 4, 2025 to July 10, 2025.

A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from July 4, 2025 to July 10, 2025.

1. Title: GaN FETs, Hydrogen Sensors and Fast Charging
Date: July 4, 2025
Source: Power Electronics News
Summary:
This week’s coverage highlights the continued adoption of GaN FETs in high-frequency power systems, new solutions for fast charging at low temperatures, and the development of a semiconductor-based hydrogen leakage sensor.
Keywords: GaN FET, hydrogen sensor, fast charging, power electronics
Manufacturers: —
Impacted Products: EV chargers, power supplies, gas detection modules
Insight:
The integration of GaN and sensing technologies is driving performance breakthroughs in clean energy, safety, and next-generation power systems.

2.Title: SMIC Expands Capacity for Mature Process Nodes
Date: July 7, 2025
Source: SemiMedia
Summary:
SMIC announced further investment in its wafer production capacity, targeting 28nm and above mature process nodes to support communication ICs and consumer-grade controllers.
Keywords: SMIC, foundry, 28nm, communication chips
Manufacturers: SMIC
Impacted Products: MCUs, PMICs, wireless transceivers
Insight:
The expansion emphasizes the ongoing importance of mature node ICs in stable, high-volume electronics markets such as IoT and consumer devices.

3.Title: Intel Restructures Advanced Fab Operations
Date: July 8, 2025
Source: TrendForce
Summary:
Intel is reportedly undergoing workforce reductions in the U.S. and Israel and considering changes to its advanced fab operations in Kiryat Gat.
Keywords: Intel, advanced process, restructuring, fab
Manufacturers: Intel
Impacted Products: Advanced processors, packaging substrates
Insight:
Operational adjustments may temporarily impact backend packaging capacity and supply continuity for high-performance computing components.

4.Title: Anglia Adds Winslow IC Sockets and Adapters
Date: July 8, 2025
Source: BISinfotech
Summary:
Anglia Components has expanded its portfolio by adding Winslow Adaptics’ high-reliability IC sockets and QFN/BGA/LGA adapter products, supporting prototyping and device replacement.
Keywords: IC socket, adapter, BGA, Winslow
Manufacturers: Anglia, Winslow Adaptics
Impacted Products: Engineering test kits, socket modules
Insight:
Precision sockets and adapter solutions are essential for R&D, rework, and high-reliability environments across aerospace, defense, and prototyping.

5.Title: Nexperia Accelerates EV IGBT Module Development
Date: July 9, 2025
Source: SemiMedia
Summary:
Nexperia is ramping up development and packaging of automotive-grade IGBT chips and modules with emphasis on high voltage, high temperature, and long-term reliability.
Keywords: Nexperia, IGBT, EV power, module packaging
Manufacturers: Nexperia
Impacted Products: EV inverters, traction modules
Insight:
This move strengthens local supply of key power devices for electric mobility and supports greater thermal and voltage tolerance in automotive systems.

6.Title: Samsung Foundry Q2 Update
Date: July 9, 2025
Source: TrendForce
Summary:
Samsung’s foundry division posted over KRW 2 trillion in losses for Q2 2025. However, critical clients like Qualcomm and NVIDIA continue to utilize advanced nodes below 4nm.
Keywords: Samsung Foundry, advanced node, 4nm, fab capacity
Manufacturers: Samsung
Impacted Products: SoCs, advanced ASICs
Insight:
Despite financial pressure, advanced node capacity remains a cornerstone for next-gen chip production, sustaining demand for high-end substrates and power delivery modules.

7.Title: IBM Launches POWER11 Processor
Date: July 9, 2025
Source: Electronics Weekly
Summary:
IBM introduced the POWER11 processor, featuring high-bandwidth memory, chiplet-based modularity, and integrated AI acceleration units for scalable enterprise workloads.
Keywords: IBM, POWER11, chiplet, AI acceleration
Manufacturers: IBM
Impacted Products: Enterprise servers, AI inference modules
Insight:
POWER11’s modular and scalable architecture will drive demand for high-speed interconnects, HBM modules, and advanced packaging technologies.

8.Title: TSMC Q2 Revenue Jumps 39%
Date: July 10, 2025
Source: Yahoo Finance
Summary:
TSMC reported a 39% revenue increase in Q2, attributed to rising 3nm chip orders for AI applications, reaffirming its leadership in high-end semiconductor manufacturing.
Keywords: TSMC, 3nm, AI chips, foundry revenue
Manufacturers: TSMC
Impacted Products: AI accelerators, edge computing chips
Insight:
Advanced node shipments are boosting demand for compute-optimized silicon and their supporting IC components, such as regulators and memory buffers.

9.Title: GaN/SiC Adoption Expands with Advanced Packaging
Date: July 10, 2025
Source: LinkedIn (Ralf Higgelke)
Summary:
GaN and SiC are gaining momentum across consumer power, aerospace, and inverter systems, with DFN-style surface mount packaging and chiplet-integrated designs gaining traction.
Keywords: GaN, SiC, DFN, chiplet power modules
Manufacturers: Various
Impacted Products: High-efficiency converters, space-rated inverters
Insight:
Innovations in compact packaging formats are enhancing performance and thermal handling in modern wide-bandgap semiconductor designs.

10.Title: Tenstorrent Acquires Blue Cheetah to Boost Chiplet Interconnect
Date: July 10, 2025
Source: EE Times
Summary:
Tenstorrent announced the acquisition of Blue Cheetah, a PHY IP firm, to accelerate development of open chiplet interface standards for heterogeneous SoC platforms.
Keywords: Tenstorrent, chiplet, PHY IP, Blue Cheetah
Manufacturers: Tenstorrent, Blue Cheetah
Impacted Products: Chiplet-based SoCs, multi-die compute chips
Insight:
Open interface innovations will drive demand for standard SerDes IP, interconnect fabrics, and high-speed routing components in next-gen chiplet ecosystems.