A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from June 27, 2025 to July 3, 2025.
1. Title: Innoscience Unveils 650V GaN-on-Si Power Devices
Date: June 27, 2025
Source: Semiconductor Today
Summary:
Innoscience launched a new family of 650V GaN-on-Silicon power transistors that combine high efficiency with mass production scalability. These devices target EV charging, adapters, and power supplies.
Keywords: GaN-on-Si, power transistors, 650V, Innoscience
Manufacturers: Innoscience
Impacted Products: EV chargers, AC-DC converters, adapters
Insight:
This strengthens GaN’s role in high-voltage power conversion, offering improved efficiency with scalable cost advantages.
2. Title:ICs Vulnerabilities Threaten Mitsubishi Electric Hardware
Date: June 27, 2025
Source: Industrial Cyber
Summary:
Critical vulnerabilities in industrial control systems (ICS) have been identified in Mitsubishi Electric’s devices, posing risks to energy, automation, and building infrastructure.
Keywords: ICS, vulnerabilities, cybersecurity, Mitsubishi
Manufacturers: Mitsubishi Electric
Impacted Products: PLCs, industrial HMIs, SCADA-linked devices
Insight:
This highlights the growing urgency of securing semiconductor-based ICS devices across vital sectors.
3.Title:Vishay Introduces AEC-Q200 0402 Thick-Film Resistors
Date: June 27, 2025
Source: Circuit Digest
Summary:
Vishay Intertechnology announced its AEC-Q200-qualified CHA Series resistors in ultra-small 0402 packages, providing high pulse load handling for automotive and industrial electronics.
Keywords: Vishay, resistors, AEC-Q200, CHA Series
Manufacturers: Vishay Intertechnology
Impacted Products: Automotive ECUs, compact industrial modules
Insight:
These space-efficient resistors address rising demands for miniaturized yet robust components in harsh environments.
4.Title:UIUC Develops Nanosheet-Based Universal Memory Prototype
Date: June 30, 2025
Source: Semiconductor Today
Summary:
Engineers at the University of Illinois Urbana-Champaign (UIUC) demonstrated a prototype universal memory using a ferroelectric nanosheet stack, blending speed and non-volatility.
Keywords: universal memory, nanosheets, ferroelectric, UIUC
Manufacturers: Research collaboration (UIUC)
Impacted Products: Next-gen memory ICs, AI accelerators
Insight:
If commercialized, this memory could replace both DRAM and flash, altering future semiconductor memory hierarchies.
5.Title:June–July Semiconductor Roundup Highlights Chip and Equipment Advancements
Date: July 1, 2025
Source: TS2
Summary:
The semiconductor industry saw sustained growth in advanced chip development and equipment deployment, with notable focus on AI processors, DUV/EUV lithography systems, and scaling technologies.
Keywords: advanced chips, EUV, semiconductor tools, AI
Manufacturers: Industry-wide
Impacted Products: AI processors, lithography systems
Insight:
The momentum in leading-edge design and manufacturing underscores the sector’s continued push toward higher performance and integration efficiency.
6.Title:ROHM Releases 100V MOSFET with 18% Lower On-Resistance
Date: July 1, 2025
Source: Circuit Digest
Summary:
ROHM launched a new 100V MOSFET optimized for power supply units in AI servers and telecom systems, achieving a significant reduction in conduction losses.
Keywords: ROHM, MOSFET, power systems, low RDS(on)
Manufacturers: ROHM Semiconductor
Impacted Products: AI server PSUs, networking hardware
Insight:
The device aligns with demands for energy-efficient, high-reliability power components in compute-dense applications.
7.Title:Q1 2025 Server Market Surges 13.4% YoY
Date: July 2, 2025
Source: Electronics Weekly
Summary:
Global server shipments grew by 13.4% in Q1 2025 year-over-year, fueled by demand for AI and enterprise infrastructure. ODM vendors gained market share with cost-effective platforms.
Keywords: server market, ODM, AI infrastructure
Manufacturers: Dell, Supermicro, Quanta, etc.
Impacted Products: Rack servers, GPU accelerators
Insight:
Semiconductor demand is surging as server build-outs accelerate across AI training and inference deployments.
8.Title:TSMC Invests in Japan for Localized Supply Chain Resilience
Date: July 2, 2025
Source: SemiMedia
Summary:
TSMC is enhancing its local ecosystem in Japan through upstream materials partnerships and backend service investment, improving redundancy in chip production.
Keywords: TSMC, Japan, localization, materials
Manufacturers: TSMC
Impacted Products: Foundry wafers, packaging modules
Insight:
TSMC’s Japan investment underscores the need for geographic diversification amid geopolitical risk.
9.Title:Novel Hydrogen Sensor Promises Safer Clean Energy
Date: July 2, 2025
Source: Power Electronics News
Summary:
Researchers introduced a semiconductor-based hydrogen sensor that enables low-leakage detection for energy storage and fuel cell systems, boosting safety and sustainability.
Keywords: hydrogen sensor, fuel cells, semiconductors
Manufacturers: Academic/industrial collaboration
Impacted Products: Fuel cell EVs, hydrogen pipelines
Insight:
Sensor innovation at the material level is critical to scaling green hydrogen across transportation and energy sectors.
10.Title:Intel May Drop Glass Substrates in Favor of External Sources
Date: July 3, 2025
Source: TrendForce
Summary:
Intel is reportedly reconsidering its in-house glass substrate program and exploring outsourcing, aiming to streamline costs for advanced packaging amid shifting CapEx priorities.
Keywords: Intel, glass substrates, outsourcing, packaging
Manufacturers: Intel Corporation
Impacted Products: Advanced 2.5D/3D packages, high-end CPUs
Insight:
Intel’s move could shift substrate innovation toward specialized OSATs, affecting future high-density interconnect strategies.
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