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  • Weekly Industry News Digest from Win Source – From September 19, 2025 to September 25, 2025

    A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from September 19, 2025 to September 25, 2025.

    1.Title: SiTime Enters $4B Resonator Market with Titan Platform
    Date: September 19, 2025
    Summary: SiTime launches the Titan MEMS resonator platform, featuring ultra-compact size and high integration, officially entering the $4 billion resonator market.
    Key Details:
    Keywords: MEMS resonator, Titan platform, SiTime, miniaturization, timing integration
    Manufacturers: SiTime Corporation
    Impacted Products: Resonators, oscillators, clocks, integrated timing modules
    Insight:   
    Titan’s integration with SoCs reduces module size and cost, driving new designs in wearables and IoT.                     

    2.Title: STMicroelectronics Joins Panel-Level Packaging Race with New French Pilot Line (launching 3Q 2026)
    Date: September 19, 2025
    Summary: ST plans a panel-level packaging (PLP) pilot line in Tours, France, launching in Q3 2026, entering the advanced packaging race.
    Key Details:
    Keywords: PLP (panel-level packaging), STMicroelectronics, advanced packaging, pilot line, Tours France
    Manufacturers: STMicroelectronics
    Impacted Products: Integrated circuits, advanced packaging modules, IC packaging solutions
    Insight:   
    ST’s PLP push with direct copper interconnect can reduce parasitics and boost integration density.                                         

    3.Title: High-Speed Data Acquisition Made Simple: Introducing the ADQ3-USB Digitizer Series
    Date: September 22, 2025
    Summary: Teledyne SP launches the ADQ3-USB high-speed digitizer series, supporting up to 10 GSPS sampling and 2 GB/s continuous data streaming.
    Key Details:
    Keywords: ADQ3-USB, high-speed digitizer, USB 3.2, data acquisition, FPGA onboard
    Manufacturers: Teledyne SP Devices
    Impacted Products: Digitizers, test & measurement instruments, data acquisition systems
    Insight:   
    Compact USB form factor enables placing digitizer near detectors, improving signal integrity and reducing latency.                         

    4.Title: Renesas Designs 3 nm Automotive Chips in India
    Date: September 22, 2025
    Summary: Renesas plans to design 3 nm automotive chips in India, enhancing its local design capability and global competitiveness.
    Key Details:
    Keywords: Renesas, 3 nm, automotive chips, India, local design
    Manufacturers: Renesas Electronics
    Impacted Products: Automotive ICs, power management, SoCs, vehicle electronics
    Insight:   
    Localizing advanced-node design in India can reduce cost, tap talent, and accelerate supply chain resilience.

    5.Title: Samsung Reportedly Plans Q4 Memory Price Hikes: DRAM Up 30%, NAND Up 10%
    Date: September 22, 2025
    Summary: Samsung reportedly plans to raise memory prices in Q4: DRAM up by 30%, NAND up by 10%.
    Key Details:
    Keywords: memory price hike, DRAM, NAND, Samsung, contract pricing
    Manufacturers: Samsung
    Impacted Products: DRAM modules, DRAM chips, NAND Flash, SSD / eMMC / UFS
    Insight:   
    Rising AI-driven demand tightens supply, enabling memory suppliers to boost margins.

    6.Title: Littelfuse Launches Compact 3 kA DFN-AK3 TVS Diode
    Date: September 23, 2025
    Summary: Littelfuse launches a compact 3 kA DFN-AK3 TVS diode, suited for high-surge protection applications.
    Key Details:
    Keywords: TVS diode, 3 kA, DFN-AK3, Littelfuse, surge protection
    Manufacturers: Littelfuse
    Impacted Products: ESD / surge protection components, transient voltage suppressors, circuit protection modules
    Insight:   
    Smaller form factor with 3 kA rating enables robust protection in space-constrained, high-reliability systems.

    7.Title: Infineon Supplies CoolGaN Power Transistors for UMEC’s Next-Generation 250 W PoE Adapter
    Date: September 23, 2025
    Summary: Infineon supplies CoolGaN power transistors to UMEC’s next-gen 250 W PoE adapter, boosting efficiency and power density
    Key Details:
    Keywords: CoolGaN, power transistor, PoE adapter, efficiency, GaN integration
    Manufacturers: Infineon Technologies
    Impacted Products: PoE adapters, power conversion modules, networking power supplies
    Insight:   
    GaN adoption enables compact, high-efficiency designs, crucial for next-gen PoE and telecom power devices.

    8.Title: Micron Counters HBM4 Speed Doubts with 11+ Gbps, Custom HBM4E Due 2027 with Higher Margins
    Date: September 24, 2025
    Summary: Micron rebuts HBM4 speed doubts, showcases over 11 Gbps performance, and plans custom HBM4E for 2027.
    Key Details:
    Keywords: HBM4, high bandwidth memory, Micron, memory speed, HBM4E
    Manufacturers: Micron Technology
    Impacted Products: HBM memory modules, high-performance computing, GPU/AI accelerators
    Insight:  
    Custom HBM4E with improved margins could shift competitive dynamics in memory markets. 

    9.Title: Thalia and X-FAB Unite to Secure Chip Supply Chains
    Date: September 24, 2025
    Summary: Thalia partners with foundry X-FAB to strengthen regional chip supply chain security and local manufacturing capacity.
    Key Details:
    Keywords: supply chain, X-FAB, Thalia, chip sovereignty, foundry cooperation
    Manufacturers: Thalia, X-FAB
    Impacted Products: Semiconductor wafers, ICs, foundry services
    Insight: 
    Regional collaboration in foundry helps reduce dependence on global supply chains and geopolitical risk.

    10.Title: SK hynix to Double EUV Fleet by 2027, Aiming for Global No.3 Position
    Date: September 25, 2025
    Summary: SK hynix plans to double its EUV tool fleet by 2027, potentially rising to third globally, bolstering its next-gen DRAM and HBM competitiveness.
    Key Details:
    Keywords: EUV,DRAM, HBM, semiconductor equipment, fabs expansion
    Manufacturers: SK hynix, ASML
    Impacted Products: Next-generation DRAM (1b, 1c, 1d nodes), HBM (High Bandwidth Memory)
    Insight:   
    Doubling EUV capacity can accelerate node advancement, narrowing the gap with leading memory rivals.

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