Category: QUESTIONS & ANSWERS
What technologies are generally used in the preparation of POLED films?
* Question
What technologies are generally used in the preparation of POLED films?
* Answer
The preparation method of the POLED film general [...]
What are the causes of black spot formation?
* Question
What are the causes of black spot formation?
* Answer
(1) The thermal effect of the organic functional layer of the device, the t [...]
What are the characteristics of the Samsung S3C2440A processor?
* Question
What are the characteristics of the Samsung S3C2440A processor?
* Answer
The outstanding feature of the S3C2440A is the processor [...]
What clock input modes can each programmable register work with?
* Question
What clock input modes can each programmable register work with?
* Answer
1) Global clock signal.2) The global clock signal is en [...]
What are the components of the OSI open system?
* Question
What are the components of the OSI open system?
* Answer
Application layer, presentation layer, session layer, transport layer, n [...]
What are the commonly used shortcut keys for HFSS modeling?
* Question
What are the commonly used shortcut keys for HFSS modeling?
* Answer
The commonly used shortcuts for HFSS modeling are as follows [...]
What is the working procedure for the master device to manage all the power supplies on the PCB?
* Question
What is the working procedure for the master device to manage all the power supplies on the PCB?
* Answer
1 Class 1: The master w [...]
What is an addition instruction?
* Question
What is an addition instruction?
* Answer
The addition instruction is divided into no carry plus ADD instruction and carry carry [...]
What is a solid electrolyte material?
* Question
What kinds of Altera configuration devices are available?
* Answer
Enhanced configuration devices: EPC16, EPC8, and EPC4;
AS seri [...]
What are the two main types of electrode materials that make up RRAM devices?
* Question
What are the two main types of electrode materials that make up RRAM devices?
* Answer
One is to use an active (diffusible) metal [...]
