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    Stacked silicon interconnect technology problem answer


    The 3D packaging method, called “stacked silicon interconnect technology,” uses a passive chip interposer, microbumps, and through-silicon via (TSV) technology to implement a multi-chip programmable platform.What does the so-called “beyond Moore’s Law” mean? A: So far, all the process nodes of FPGA follow the development of Moore’s Law, and the logic capacity is doubled, and the cost is reduced by half.Why can’t customers simply connect two or more FPGAs for large-scale design? A: This simple connection method has three major drawbacks: First, the number of available I/Os is limited, and it is not enough to connect for partition design.a complex network of signal transmissions between different FPGAs,Since the interposer is passive, there is no other heat dissipation problem other than the heat consumed by the FPGA chip.Therefore, if such a large monolithic device can be fabricated, an FPGA product using stacked silicon interconnect technology is equivalent to a single chip.4. Is the stacking silicon interconnect technology reliable? A: Yes, it is very reliable.FPGAs produced by stacked silicon interconnect technology are targeted at those people? A: Any customer who needs a high-density FPGA that exceeds the current level of logic density can benefit from FPGA products that use stacked silicon interconnect technology.

    Designers who previously used multiple FPGAs in a system will enjoy higher bandwidth and lower power consumption between FPGA chips because there is no need to drive the chip through I/O interfaces and PCB traces between adjacent FPGAs.And a faster way to connect.Among them are design rule checks (DRCs) and software information to guide users to achieve logical layout between FPGA chips.In addition, the PlanAhead and FPGAEditor features enhance the graphical representation of FPGA devices based on stacked silicon interconnect technology, facilitating interactive design layout planning, analysis, and debugging.Customers can perform logical layout planning on specific FPGA chips if needed.Without any such constraints, software tools allow algorithms to intelligently place relevant logic within the FPGA chip and follow inter-chip and on-chip connectivity and timing rules.


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