A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from June 4th to June 20th, 2024
1. Source: Circuit Digest – Black Semiconductor boosts chips
Date: June 14, 2024
Keywords: Black Semiconductor, graphene technology
Impacted Products: —
Manufacturers: Black Semiconductor
Summary: Black Semiconductor in Germany focuses on strengthening Europe’s chip industry by leveraging innovative graphene technology. The company’s strategy includes increasing local production, enhancing R&D, and fostering collaborations within the industry to boost competitiveness and technological advancements.
2. Source: All About Circuits – TI GaN Boosts Efficiency
Date: June 15, 2024
Keywords: Texas, DRV7308, GaN
Impacted Products: GaN smart power module
Manufacturers: Texas Instruments
Summary: Texas Instruments unveiled the DRV7308, a 650 V three-phase GaN smart power module (IPM) at PCIM 2024 in Germany, designed to enhance the energy efficiency of motors used in home appliances and HVAC systems.
3. Source: TrendForce – Kioxia Resumes Production
Date: June 17, 2024
Keywords: Kioxia, memory market
Impacted Products: NAND flash memory
Manufacturers: Kioxia
Summary: With improvements in the memory market, Kioxia has stopped production cuts and secured additional bank financing, coinciding with rising demand for NAND flash in smartphones and computers.
4. Source: TechInsights – Advanced Packaging’s Role in Value Delivery
Date: June 17, 2024
Keywords: Advanced packaging, transistor scaling, DTCO
Impacted Products: Integrated circuits, 3D transistors
Manufacturers: —
Summary: Device miniaturization is surpassing the limits of traditional transistor scaling. The shift towards integrated chiplets and 3D transistors is driven by Design-Technology Co-Optimization (DTCO), maintaining performance improvements in the post-Moore’s Law era.
5. Source: Circuit Digest – India-US Semiconductor and Supply Chain Pact
Date: June 18, 2024
Keywords: India, USA, semiconductor partnership
Impacted Products: Semiconductors
Manufacturers: —
Summary: The United States and India have established a semiconductor partnership to strengthen semiconductor design and manufacturing capabilities. This strategic pact is aimed at enhancing both nations’ technological prowess and securing their supply chains amidst increasing global demands for semiconductors.
6. Source: EE Times – Rapidus to Open 2 nm Pilot Fab
Date: June 19, 2024
Keywords: Rapidus, 2 nm fab, IBM, imec
Impacted Products: Advanced silicon chips
Manufacturers: Rapidus
Summary: Japanese startup Rapidus plans to open a 2 nm pilot fab in 2025 to produce advanced silicon chips, with support from IBM and imec, aiming for faster production and greater scalability compared to competitors like TSMC and Samsung.
7. Source: TechInsights – Intel Updates FIVR with New Inductor
Date: June 19, 2024
Keywords: Intel, Coax MIL, FIVR
Impacted Products: Coax MIL, FIVR
Manufacturers: Intel
Summary: Intel has updated its fully integrated voltage regulator (FIVR) system with a new coaxial magnetic integrated inductor (Coax MIL) for better voltage regulation in processors like Sapphire Rapids.
8. Source: Power Electronics News – onsemi Establishes Czech Facility
Date: June 19, 2024
Keywords: onsemi, silicon carbide
Impacted Products: Semiconductors
Manufacturers: onsemi
Summary: onsemi is investing $2 billion to build a new silicon carbide manufacturing plant in the Czech Republic to increase the supply of energy-saving semiconductors and support EU carbon reduction goals.
9. Source: TrendForce – Samsung and SK Hynix Implement Hybrid Bonding
Date: June 20, 2024
Keywords: Samsung, SK Hynix, 3D DRAM
Impacted Products: DRAM chips
Manufacturers: Samsung, SK Hynix
Summary: Samsung and SK Hynix will adopt hybrid bonding technology for 3D DRAM to enhance chip compactness and efficiency. This technique allows for bumpless vertical stacking, significantly increasing capacity and reducing interference.
10. Source: All About Circuits – PicoScope’s New USB-Powered Oscilloscope
Date: June 20, 2024
Keywords: Pico Technology, PicoScope 3000E, USB-powered
Impacted Products: Oscilloscopes
Manufacturers: Pico Technology
Summary: Pico Technology has released the PicoScope 3000E, the first 5 GS/s oscilloscope powered by USB. This new model offers improved bandwidth and sampling rates, integrating power and data transmission through a single USB connection, making it highly portable for mobile testing and measurements.
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