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  • Weekly Industry News Digest from Win Source – From June 14th to June 20th, 2024

    A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from June 4th to June 20th, 2024

    1. Source: Circuit Digest – Black Semiconductor boosts chips

    Date: June 14, 2024

    Keywords: Black Semiconductor, graphene technology

    Impacted Products:

    Manufacturers: Black Semiconductor

    Summary: Black Semiconductor in Germany focuses on strengthening Europe’s chip industry by leveraging innovative graphene technology. The company’s strategy includes increasing local production, enhancing R&D, and fostering collaborations within the industry to boost competitiveness and technological advancements.

    2. Source: All About Circuits – TI GaN Boosts Efficiency

    Date: June 15, 2024

    Keywords: Texas, DRV7308, GaN

    Impacted Products: GaN smart power module

    Manufacturers: Texas Instruments

    Summary: Texas Instruments unveiled the DRV7308, a 650 V three-phase GaN smart power module (IPM) at PCIM 2024 in Germany, designed to enhance the energy efficiency of motors used in home appliances and HVAC systems.

    3. Source: TrendForce – Kioxia Resumes Production

    Date: June 17, 2024

    Keywords: Kioxia, memory market

    Impacted Products: NAND flash memory

    Manufacturers: Kioxia

    Summary: With improvements in the memory market, Kioxia has stopped production cuts and secured additional bank financing, coinciding with rising demand for NAND flash in smartphones and computers.

    4. Source: TechInsights – Advanced Packaging’s Role in Value Delivery

    Date: June 17, 2024

    Keywords: Advanced packaging, transistor scaling, DTCO

    Impacted Products: Integrated circuits, 3D transistors

    Manufacturers: —

    Summary: Device miniaturization is surpassing the limits of traditional transistor scaling. The shift towards integrated chiplets and 3D transistors is driven by Design-Technology Co-Optimization (DTCO), maintaining performance improvements in the post-Moore’s Law era.

    5. Source: Circuit Digest – India-US Semiconductor and Supply Chain Pact

    Date: June 18, 2024

    Keywords: India, USA, semiconductor partnership

    Impacted Products: Semiconductors


    Summary: The United States and India have established a semiconductor partnership to strengthen semiconductor design and manufacturing capabilities. This strategic pact is aimed at enhancing both nations’ technological prowess and securing their supply chains amidst increasing global demands for semiconductors.

    6. Source: EE Times – Rapidus to Open 2 nm Pilot Fab

    Date: June 19, 2024

    Keywords: Rapidus, 2 nm fab, IBM, imec

    Impacted Products: Advanced silicon chips

    Manufacturers: Rapidus

    Summary: Japanese startup Rapidus plans to open a 2 nm pilot fab in 2025 to produce advanced silicon chips, with support from IBM and imec, aiming for faster production and greater scalability compared to competitors like TSMC and Samsung.

    7. Source: TechInsights – Intel Updates FIVR with New Inductor

    Date: June 19, 2024

    Keywords: Intel, Coax MIL, FIVR

    Impacted Products: Coax MIL, FIVR

    Manufacturers: Intel

    Summary: Intel has updated its fully integrated voltage regulator (FIVR) system with a new coaxial magnetic integrated inductor (Coax MIL) for better voltage regulation in processors like Sapphire Rapids.

    8. Source: Power Electronics News – onsemi Establishes Czech Facility

    Date: June 19, 2024

    Keywords: onsemi, silicon carbide

    Impacted Products: Semiconductors

    Manufacturers: onsemi

    Summary: onsemi is investing $2 billion to build a new silicon carbide manufacturing plant in the Czech Republic to increase the supply of energy-saving semiconductors and support EU carbon reduction goals.

    9. Source: TrendForce – Samsung and SK Hynix Implement Hybrid Bonding

    Date: June 20, 2024

    Keywords: Samsung, SK Hynix, 3D DRAM

    Impacted Products: DRAM chips

    Manufacturers: Samsung, SK Hynix

    Summary: Samsung and SK Hynix will adopt hybrid bonding technology for 3D DRAM to enhance chip compactness and efficiency. This technique allows for bumpless vertical stacking, significantly increasing capacity and reducing interference.

    10. Source: All About Circuits – PicoScope’s New USB-Powered Oscilloscope

    Date: June 20, 2024

    Keywords: Pico Technology, PicoScope 3000E, USB-powered

    Impacted Products: Oscilloscopes

    Manufacturers: Pico Technology

    Summary: Pico Technology has released the PicoScope 3000E, the first 5 GS/s oscilloscope powered by USB. This new model offers improved bandwidth and sampling rates, integrating power and data transmission through a single USB connection, making it highly portable for mobile testing and measurements.


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