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  • Weekly Industry News Digest from Win Source – From June 7th to June 13th, 2024

    A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from June 7th to June 13th, 2024

    1. Source: TrendForce – VIS and NXP to Build a 12-Inch Fab

    Date: June 7, 2024

    Keywords: VIS, NXP

    Impacted Products: Semiconductor

    Manufacturers: VIS, NXP

    Summary: Vanguard International Semiconductor (VIS) and NXP Semiconductors have announced a joint venture to construct a 12-inch semiconductor fabrication plant in Singapore. The $7.8 billion investment aims to boost production capacity, focusing on mixed-signal, power management, and analog products for various markets. The facility, expected to begin mass production by 2027, will strengthen Singapore’s position as a key hub in the global semiconductor industry.

    2.Source: Circuit Digest – Zoho Ventures into Chip-making

    Date: June 9, 2024

    Keywords: Zoho, chip-making

    Impacted Products: 

    Manufacturers: Zoho

    Summary: Zoho, an Indian software firm, has announced a $700 million investment to enter the chip-making business. This move aims to enhance India’s position in the global semiconductor industry and diversify Zoho’s business operations into high-tech manufacturing.

    3.Source: Power Electronics – Infineon Unveils CoolMOS™ 8

    Date: June 9, 2024

    Keywords: Infineon, Silicon MOSFET

    Impacted Products: CoolMOS™ 8

    Manufacturers: Infineon

    Summary: Infineon Technologies introduces the 600 V CoolMOS™ 8, a next-generation silicon MOSFET technology designed to enhance efficiency and performance in power electronics. This innovation is targeted at applications requiring high efficiency, reliability, and compact form factors, such as power supplies and electric vehicles.

    4. Source:Power Electronics – CGD Announces GaN Power ICs

    Date: June 7, 2024

    Keywords: CGD, GaN Power ICs, RDS

    Impacted Products: GaN Power ICs

    Manufacturers: CGD

    Summary: Cambridge GaN Devices (CGD) has introduced new low RDS(on) GaN power ICs, featuring advanced die and packaging technology. These innovations promise enhanced performance and efficiency, targeting applications in power management and energy conversion sectors.

    5. Source: SMT Today – Silicon Mountain Offers PCB Coating

    Date: June 11, 2024

    Keywords: Silicon Mountain, PCB

    Impacted Products: PCB

    Manufacturers: Silicon Mountain

    Summary: Silicon Mountain has introduced conformal coating services to enhance the protection and reliability of printed circuit boards (PCBs). These coatings provide a protective barrier against environmental factors such as moisture, dust, and chemicals, ensuring the longevity and performance of PCBs in harsh conditions.

    6. Source:SMT Today – Zollner and Luminovo Set New Standard

    Date: June 11, 2024

    Keywords: Zollner, Luminovo, digital supply chain, EMS

    Impacted Products: Digital supply chain solutions

    Manufacturers: All

    Summary: Zollner Elektronik AG and Luminovo have collaborated to establish a new benchmark for digital supply chain collaboration in the Electronic Manufacturing Services (EMS) industry. This partnership focuses on enhancing efficiency, transparency, and integration across supply chain operations by utilizing advanced digital tools and platforms.

    7. Source: EENews Europe – Intel Launches EV Chip

    Date: June 10, 2024

    Keywords: Intel, EV chip, integrated circuit

    Impacted Products: Integrated Circuit

    Manufacturers: Intel

    Summary: Intel has introduced a new integrated chip designed for electric vehicles (EVs), aimed at improving performance and efficiency. This chip combines multiple functions into a single package, reducing the complexity and cost of EV power systems while enhancing overall vehicle efficiency and reliability.

    8. Source:EENews Europe – Mitsubishi Ships SiC Modules

    Date: June 11, 2024

    Keywords: Mitsubishi, SiC modules, SBD

    Impacted Products: SiC

    Manufacturers: Mitsubishi

    Summary: Mitsubishi Electric has begun shipping Silicon Carbide (SiC) power modules integrated with Schottky Barrier Diodes (SBDs). These advanced modules are designed to enhance efficiency and performance in power conversion applications, making them suitable for use in renewable energy systems, electric vehicles, and industrial equipment.

    9. Source: TrendForce – IC Design Companies Adopt TSMC’s 3nm Process

    Date: June 13, 2024

    Keywords: TSMC, 3nm process, IC design, price hikes

    Impacted Products: Integrated Circuits


    Summary: IC design companies are increasingly adopting TSMC’s 3nm process technology, leading to cost-driven price increases. This shift aims to enhance performance and energy efficiency in high-end computing and mobile devices, though it also brings higher production costs that are being passed on to customers.

    10. Source: All About Circuits – ST Rolls Out New IMU

    Date: June 12, 2024

    Keywords: STM, IMU

    Impacted Products: IMU

    Manufacturers: STMicroelectronics

    Summary: STMicroelectronics has launched a new Inertial Measurement Unit (IMU) tailored for industrial and robotic applications. This IMU offers enhanced performance in motion tracking and stability, making it ideal for use in automation, robotics, and industrial machinery.


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