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  • Weekly Industry News Digest from Win Source – From May 20th to May 24th, 2024

    A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from May 20th to May 24th, 2024.

    1. Source:Power Electronics News – COSEL HFA3500TF

    Date: May 20, 2024

    Key WordsCOSEL HFA3500TF Power Supply

    Impacted ProductsPower Supply


    Summary: COSEL has released a new 3.5kW three-phase AC/DC power supply, the HFA3500TF, designed specifically for robust industrial applications. This product promises enhanced efficiency and reliability in demanding environments.

    2. Source: SMT Today – Teradyne’s Milestone

    Date: May 21, 2024

    Key WordsTeradyne 8000th J750 Test System

    Impacted ProductsSemiconductor Test System


    Summary: Teradyne has achieved a significant milestone by shipping its 8000th J750 semiconductor test system. This system is celebrated for its efficiency and popularity, having become a staple in testing across the semiconductor industry.

    3. Source:Electropages – Micron’s $50B Investment

    Date: May 21, 2024

    Key WordsMicron’s $50B Investment

    Impacted ProductsMemory Chip


    Summary: Micron Technology has announced a massive investment plan worth $50 billion, supported by the US CHIPS Act. This investment aims to significantly expand its memory chip manufacturing capacity in the United States, bolstering domestic production capabilities.

    4.Source:SMT Today – SMTconnect Nuremberg

    Date: May 21, 2024

    Key WordsSMTconnect Nuremberg

    Impacted Products


    Summary: SMTconnect 2024 in Nuremberg was a major event for the microelectronics sector, featuring numerous new product introductions, expert-led technical forums, and extensive networking opportunities for professionals in the industry.

    5.Source:Circuit Digest – Nexperia SiC MOSFET

    Date: May 22, 2024

    Key WordsNexperia SiC MOSFET

    Impacted ProductsSiC MOSFET


    Summary:  Nexperia has unveiled a new 1200V silicon carbide (SiC) MOSFET housed in D2PAK-7 packaging. This new component is designed to offer superior performance in high voltage applications, enhancing energy efficiency.

    6. Source: TrendForce – DRAM and NAND Flash Prices

    Date: May 22, 2024

    Key WordsDRAM and NAND Flash Prices Drop

    Impacted Products


    Summary: Semiconductor fabs are depleting their silicon wafer inventories, leading to an increase in orders expected in the second half of 2024. This trend is due to strategic reduction in purchases amidst market volatility. As inventories run low, fabs may increase orders, which may stabilise the silicon wafer market.

    7. Source:Circuit Digest – Dual Motor Control Board

    Date: May 23, 2024

    Key WordsDual Motor Control Board

    Impacted ProductsMotor Control Board


    Summary: STMicroelectronics has launched the EVSPIN32G4-DUAL, a cutting-edge board designed to control two motors simultaneously using a single integrated driver. This innovative board is engineered to simplify motor control in complex applications, offering robust performance and high efficiency.

    8. Source: Electropages – Apple AI Chips

    Date: May 23, 2024

    Key WordsApple and TSMC AI Chips

    Impacted ProductsAI Chips

    Manufacturers:Apple, TSMC

    Summary: Apple is working with TSMC on custom AI servers designed to improve AI performance and privacy within its ecosystem, potentially rivalling NVIDIA and AMD in the AI space.

    9. Source: SMT Today – EWPT 2024

    Date: May 24, 2024

    Key WordsEWPT 2024

    Impacted Products —


    Summary: The Electronic Warfare and Photonics Technology (EWPT) 2024 conference highlighted the latest advancements and products in the field, fostering industry collaboration and knowledge exchange among professionals and experts.

    10. Source:TrendForce – Samsung’s HBM Chips

    Date: May 24, 2024

    Key WordsSamsung HBM Chip Issues

    Impacted ProductsHBM Chips


    Summary: Samsung faces challenges as its High Bandwidth Memory (HBM) chips did not meet Nvidia’s performance standards due to issues related to overheating and excessive power consumption. This situation has implications for Samsung’s standing in the competitive memory chip market.


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