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  • XC7K160T-3FFG676E Product Overview: A High-Performance Kintex-7 FPGA for High-Speed Computing and Communication

    1. Device Positioning and Application Overview

    The XC7K160T-3FFG676E is a mainstream high-performance FPGA in the Xilinx (now AMD) Kintex-7 family. Built on a 28nm process, it offers a balance of high logic density, power efficiency, and high-speed serial connectivity. This device represents a mature and cost-effective option within the 7 Series, with strong market adoption across sectors, including communications, industrial systems, defense, and data processing.

    Packaged in an FFG676 BGA (27×27 mm), the XC7K160T supports a high number of user I/Os and transceivers, making it a preferred choice for FPGA accelerator cards, industrial control boards, network modules, and imaging acquisition systems.

    2. Product Specifications at a Glance

    Parameter

    Specification

    FPGA Family

    Kintex-7

    Logic Resources

    ~162K LUTs, ~202K Flip-Flops

    DSP Slices

    600

    High-Speed Transceivers

    16 GTX (up to 12.5 Gbps per lane)

    On-Chip Memory

    ~1.4 MB Block RAM

    Core Voltage

    1.0V (Core), 1.8V / 2.5V / 3.3V (I/O)

    Temperature Grade

    Industrial (-40°C to +100°C)

    Package

    FFG676 (BGA, 27×27 mm)

    Lifecycle Status

    Active (stable supply for mass production)

    RoHS Compliance

    Yes

    Toolchain Support

    Xilinx Vivado Design Suite

    3. Platform Compatibility and Application Domains

    With a well-balanced architecture and packaging, the XC7K160T-3FFG676E fits a broad range of system types, including:

    Application Domain

    Typical Use Cases

    Communication Systems

    CPRI/eCPRI interface boards, optical modules, switch cards

    Industrial Platforms

    Imaging capture cards, motion control baseboards

    Data Center & AI

    FPGA accelerators, edge SmartNICs

    Security & Vision

    High-speed video capture and buffering modules

    Defense & Aerospace

    Seeker signal processors, beamforming controllers

    This model is particularly suited for use cases that demand moderate to high logic density, high-speed serial transceivers, and embedded programmability, without requiring the extreme resources of higher-tier devices.

    4. Packaging & Board-Level Design Guidelines

    • Package Info:FFG676 is a Flip-Chip Fine-Pitch BGA with 1.0 mm pitch—moderate layout complexity
    • Cross-Compatibility:Shares footprint characteristics with certain high-pin-count Artix-7/Kintex-7 devices, aiding design portability
    • PCB Design: Recommended for 8-layer or higher PCBs; isolate power zones per I/O bank
    • Layout Considerations: 27×27 mm package is ideal for boards ≥100×100 mm; not suited for ultra-compact designs

    5. Kintex-7 Series Model Comparison

    Model

    LUTs

    Transceivers

    Package

    Application Complexity

    XC7K70T-1FBG484I

    65K

    4

    FBG484

    Entry-level

    XC7K160T-3FFG676E

    162K

    16

    FFG676

    Mid-High Performance

    XC7K325T-2FFG900I

    326K

    16

    FFG900

    High-density protocols

    XC7K410T-3FFG900E

    406K

    24

    FFG900

    Multi-channel logic

    This comparison highlights resource and interface scaling within the Kintex-7 family, aiding engineers in BOM planning, migration evaluation, and design optimization.

    6. Supply Feasibility and Selection Guidance

    • Lifecycle: Active and stable for volume production
    • Toolchain: Fully supported by Vivado Design Suite, ensuring long-term maintainability
    • Recommended Role: Ideal as a main controller for new designs, or as an upgrade from older Virtex-5 / Kintex-6 platforms
    • Upgrade Path: For higher logic or transceiver needs, consider migration to XC7K325T or above
    • Supply Chain: WIN SOURCE offers stable inventory, BOM matching, and replacement support

    7. Summary: Value from a Procurement Perspective

    The XC7K160T-3FFG676E offers an optimal balance of performance, cost, and deployment flexibility for mid-to-high-end FPGA applications. With its ample logic resources, mainstream high-speed interfaces, and robust industrial-grade packaging, it provides a solid control core for EMS, ODM, and OEM platforms.

    It is well-suited for mass production programs and supports rapid deployment for teams already familiar with the 7 Series ecosystem. For designs prioritizing reliability, interface density, and long-term supply stability, this model delivers broad compatibility and procurement confidence.

    To learn more about the available electronic components, selection support, and  related services, please visit the official WIN SOURCE website.

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