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  • Ten Daily Electronic Common Sense-Section 58

    What are the recommended LSP APS protection group protection types?

    Set to 1:1 to save bandwidth. The switching mode is configured as double-ended switching. Generally, a tunnel with a shorter path is used as a working path, and a tunnel with a longer path is configured as a protection path. The recovery mode is set to recovery, and the delay time is set to 0. Name it, such as “local NE name peer NE name protection group ID”.

    What three conditions does the UCC28610 need to start the next cycle modulator?

    • Since the time of the last turn-on edge must be equal to or greater than the time required for the feedback process, it is determined by the feedback current.
    • Because the time of the last opening edge must be longer than the minimum period established by UCC28610 (usually 7.59s at 133kHz).
    • A zero crossing of the ZCD voltage from high to low is immediately followed, or it is longer than “.itzcd (2.41as) because the last zero crossing has been detected.

    What conditions do TL loops need to meet?

    • The T1 loop is a closed loop, in which the bird has an even number (at least two) of forward-biased emitter junctions (the bias circuit is not shown in the figure).
    • In the TL loop, the number of forward-biased emitter junctions arranged in the clockwise direction (CW) and the number of forward-biased emitter junctions arranged in the counterclockwise direction (CCW) must be equal.

    What are the main characteristics of magnetic diodes?

    1. Volt-ampere characteristics of magneto-sensitive diodes
    2. Magnetoelectric characteristics of magneto-sensitive diodes
    3. Temperature characteristics of magneto-sensitive diodes

    What are the ALOHA algorithms?

    1. Pure ALOHA algorithm
    2. Time slot ALOHA algorithm
    3. Frame time slot ALOHA algorithm
    4. Dynamic frame time slot ALOHA algorithm

    What is grayscale?

    Grayscale refers to the level of brightness between black and white in a black-and-white image. The more gray levels, the richer the black-to-white gradation of the image, and the sharper the details.

    In terms of LED lighting technology, what are the two major development areas that National Semiconductor expects?

    • Backlight applications for laptops and RGB TVs.
    • Power factor correction controller IC.

    Which parts of the FPGA chip are mainly completed?

    It is completed by 7 parts, which are programmable input/output unit, basic programmable logic unit, complete clock management, embedded block RAM, abundant wiring resources, embedded low-level functional units and embedded dedicated hardware modules.

    What five types of errors are not included in CAN?

    1. Dislocation: When a node sends a bit, it monitors the bus state at the same time; when the monitored state is different from the sent bit, it is determined as a bit error. However, when sending the arbitration field, stuffing bit or answering field, it is not considered an error when a recessive bit is sent and a dominant state is monitored. When a fault reception flag is sent, it is not considered an error if a dominant bit is detected.
    2. Filling error: When 6 consecutive identical bits are detected, it is determined to be a filling error.
    3. CRC check error: When the calculated CRC check code is different from the received CRC sequence, it is determined to be a CRC check error.
    4. Format error: When a fixed field contains an illegal value, it is determined as a format error.
    5. Response error: When the sender cannot monitor the dominant bit in the response field, it is determined as a response error. When a node has bit error, padding error, format error and response error, it starts to send an error flag at the next bit time; and when a CRC check error occurs, it starts to send an error flag after the response delimiter.

    What are the three typical components of a surface micromachining device?

    Surface microfabricated devices are composed of three typical components: sacrificial layer (or void layer), microstructure layer and insulating layer.


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