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  • Weekly Industry News Digest from Win Source – From June 13, 2025 to June 19, 2025

    A comprehensive overview of the current state of affairs in the electronic components industry, highlighting notable developments and emerging trends from June 13, 2025 to June 19, 2025

    1. Title: ROHM Develops 4th-Gen SiC MOSFETs
    Date: June 13, 2025
    Source: Semiconductor Today
    Summary:
    ROHM released its fourth-generation SiC MOSFETs, which feature improved switching efficiency and reduced on-resistance. These devices are designed for use in EV inverters, power supplies, and industrial drives.
    Key Details:
    Keywords: SiC, ROHM, MOSFET, EV inverter, power electronics
    Manufacturers: ROHM Semiconductor
    Impacted Products: Automotive inverters, industrial power supplies
    Insight:
     This advancement strengthens ROHM’s position in high-efficiency power devices, addressing critical needs in electric mobility and green energy applications.

    2. Title: Bourns Launches 1500VDC POWrFuse for Solar Systems
    Date: June 13, 2025
    Source: Power Electronics News
    Summary:
    Bourns unveiled its POWrFuse high-power fuse series, designed for 1500VDC solar applications. These fuses offer high interrupt ratings and meet stringent safety standards for renewable energy systems.
    Key Details:
    Keywords: Fuse, Bourns, solar power, energy protection
    Manufacturers: Bourns, Inc.
    Impacted Products: Solar panel protection systems, high-voltage battery systems
    Insight:
     Bourns’ innovation supports growing solar infrastructure needs with reliable overcurrent protection for high-voltage DC systems.

    3. Title: SEMICON West 2025 to Debut in Phoenix
    Date: June 16, 2025
    Source: SEMI.org
    Summary:
    SEMICON West 2025 will be held in Phoenix, Arizona for the first time, spotlighting the region’s critical role in semiconductor manufacturing. The event emphasizes AI integration, sustainability, and workforce innovation.
    Key Details:
    Keywords: SEMICON West, Arizona, AI, manufacturing ecosystem
    Manufacturers: Broad industry participation
    Impacted Products: Semiconductor tools, AI-integrated devices
    Insight:
     The venue change reflects Arizona’s strategic importance in U.S. chip manufacturing, reinforcing localization and innovation.

    4. Title: Leading-Edge Semiconductor Market to Reach $1 Trillion by 2034
    Date: June 17, 2025
    Source: GlobeNewswire
    Summary:
    A new report predicts that the leading-edge semiconductor market will reach USD 1 trillion by 2034, fueled by demand in AI, mobility, and 5G. Growth will be driven by advanced nodes and system-level integration.
    Key Details:
    Keywords: semiconductor forecast, AI, 5G, advanced nodes
    Manufacturers: Multiple Tier-1 foundries and IDM players
    Impacted Products: <5nm chips, AI accelerators
    Insight:
     This projection signals the increasing strategic and economic weight of cutting-edge semiconductor technologies.

    5. Title: IQE & Quinas Introduce UltraLam Interconnect for Dense ICs
    Date: June 18, 2025
    Source: Semiconductor Today
    Summary:
    IQE and Quinas have co-developed UltraLam, a 3D vertical nanowire interconnect platform designed to boost performance and density in next-gen logic and memory devices.
    Key Details:
    Keywords: IQE, Quinas, UltraLam, 3D integration, nanowire
    Manufacturers: IQE, Quinas Technology
    Impacted Products: Advanced SoCs, memory modules
    Insight:
     UltraLam may redefine packaging standards for high-density ICs, especially in AI and data-centric computing.

    6. Title: Texas Instruments to Invest $60B in U.S. Fab Expansion
    Date: June 18, 2025
    Source: CNN
    Summary:
    TI announced a massive $60 billion investment into U.S.-based semiconductor manufacturing, including new 300mm wafer fabs to strengthen domestic production and supply chain resilience.
    Key Details:
    Keywords: Texas Instruments, fabs, 300mm wafers, U.S. manufacturing
    Manufacturers: Texas Instruments
    Impacted Products: Analog ICs, embedded processors
    Insight:
     This investment aligns with U.S. industrial policy, boosting chip self-sufficiency and long-term strategic capacity.

    7. Title: CEA-Leti and Soitec Partner on Secure FD-SOI ICs
    Date: June 18, 2025
    Source: GlobeNewswire
    Summary:
    CEA-Leti and Soitec have formed a strategic alliance to develop FD-SOI-based solutions that enhance chip security for IoT and edge applications.
    Key Details:
    Keywords: FD-SOI, security, Leti, Soitec, IoT
    Manufacturers: CEA-Leti, Soitec
    Impacted Products: Secure MCUs, IoT edge chips
    Insight:
     This partnership taps into FD-SOI’s low-power and radiation tolerance, providing secure and efficient ICs for connected systems.

    8. Title: Electronic-Grade Sulfuric Acid Market to Grow 6.6% CAGR
    Date: June 18, 2025
    Source: GlobeNewswire
    Summary:
    Rising demand from semiconductor fabs will drive the electronic-grade sulfuric acid market at a CAGR of 6.6% through 2030. This chemical is critical for wafer cleaning and microfabrication processes.
    Key Details:
    Keywords: sulfuric acid, wafer processing, semiconductor chemicals
    Manufacturers: BASF, Mitsubishi Chemical, Avantor
    Impacted Products: Wafers, photolithography equipment
    Insight:
     Chemical purity is increasingly vital as nodes shrink, boosting specialty chemical markets supporting advanced semiconductor processes.

    9. Title: TI Expands SiC Portfolio and Introduces Compact FET Packages
    Date: June 19, 2025
    Source: Electronics Weekly
    Summary:
    Texas Instruments expanded its silicon carbide product lineup, including new isolated gate drivers and compact FET packages aimed at improving power density in automotive and industrial sectors.
    Key Details:
    Keywords: SiC, gate drivers, compact FET, TI
    Manufacturers: Texas Instruments
    Impacted Products: EV power modules, industrial drives
    Insight:
     TI’s enhancements reflect growing adoption of wide bandgap semiconductors in high-performance, space-constrained applications.

    10. Title: Infineon Enters ‘New Space’ Market with Radiation-Hardened ICs
    Date: June 19, 2025
    Source: Electronics Weekly
    Summary:
    Infineon is targeting the commercial space industry with new radiation-hardened components, including microcontrollers and power ICs for satellites and LEO constellations.
    Key Details:
    Keywords: Infineon, radiation-hardened, space electronics
    Manufacturers: Infineon Technologies
    Impacted Products: Satellite subsystems, space-grade ICs
    Insight:
     This move taps into rising demand for space-ready electronics as commercial and defense space sectors expand rapidly.

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