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  • Weekly Industry News Digest from Win Source – From May 31st to June 6th, 2024

    A comprehensive overview of the current state of affairs in the electronic components industry is presented, highlighting notable developments and emerging trends from May 31st to June 6th, 2024. 

    1. Source: Circuit Digest – India’s First Quantum Microchip
    Date: May 30, 2024
    Keywords: India’s Quantum Microchip
    Impacted Products: Imager
    Manufacturers: IIT Bombay, TCS
    Summary: IIT Bombay and TCS have developed India’s first quantum diamond microchip imager, expected to significantly enhance the precision and efficiency of chip inspections. This breakthrough marks a major advancement in India’s technology sector, emphasizing innovation in semiconductor processing.

    2. Source: All About Circuits – Innovations in Gate Drivers
    Date: May 30, 2024
    Keywords: Gate Driver Innovations
    Impacted Products: Industrial Gate Drivers
    Manufacturers: Littelfuse, Allegro Microsystems, Power Integrations
    Summary: New gate drivers introduced by Littelfuse, Allegro Microsystems, and Power Integrations are designed to enhance flexibility and efficiency in industrial applications, crucial for controlling high-power semiconductor switches.

    3. Source: Power Electronics News – STMicro’s Silicon Carbide Plant
    Date: June 1, 2024
    Keywords: STMicro SiC Plant
    Impacted Products: Silicon Carbide Devices
    Manufacturers: STMicroelectronics
    Summary: STMicroelectronics is establishing a fully integrated Silicon Carbide manufacturing facility in Catania, Italy, aiming to produce all stages of SiC devices by 2026, with full capacity expected by 2033.

    4. Source: TrendForce – AMD’s New AI Chip
    Date: June 3, 2024
    Keywords: AMD AI Chip
    Impacted Products: MI325X AI Chip
    Manufacturers: AMD
    Summary: AMD unveils the MI325X AI chip at Taipei Computex, boasting 30% faster computing power than NVIDIA’s H200, highlighting significant advancements in AI processing capabilities.

    5. Source: Circuit Digest – Infineon’s Semiconductor Expansion
    Date: June 4, 2024
    Keywords: Infineon CoolSiC Expansion
    Impacted Products: CoolSiC MOSFETs
    Manufacturers: Infineon Technologies
    Summary: Infineon Technologies AG announced the expansion of its family of CoolSiC MOSFETs and the introduction of a new generation of high-voltage and medium-voltage CoolGaN transistor families, technologies focused on increasing system power density in automotive applications

    6. Source: SMT Today – Semiconductor Metrology Tools
    Date: June 4, 2024
    Keywords: Semiconductor Metrology Tools
    Impacted Products: ZenStar, Meister Series
    Manufacturers:
    Summary: Koh Young will demonstrate its ZenStar and Meister series in July 2024 at SEMICON West. These tools address manufacturing challenges in semiconductor and advanced packaging applications by providing real-time insights and predictive analytics to improve yields, reduce defects and increase productivity.

    7. Source: EE Times – Niobium’s FHE Chip Innovation
    Date: June 5, 2024
    Keywords: Niobium FHE Chip
    Impacted Products: FHE Chip
    Manufacturers: Niobium
    Summary: Niobium has launched its FHE chip, which claims to perform 5,000 times faster than standard CPUs, and secured $5.5 million in seed funding. This advancement could significantly increase the viability of securely processing encrypted data in the cloud.

    8. Source: BISinfotech – Rohde & Schwarz USB 3.2 Testing
    Date: June 5, 2024
    Keywords: USB 3.2 Testing
    Impacted Products: USB 3.2 Devices
    Manufacturers: Rohde & Schwarz
    Summary: Rohde & Schwarz has been approved by the USB Implementers Forum (USB-IF) for USB 3.2 Gen 1 and Gen 2 conformance testing. Their test solutions (R&S RTP-K101 for transmitters and R&S RTP-K102 for receivers) use R&S RTP oscilloscopes to ensure that devices are compliant with the USB 3.2 standard.

    9. Source: BISinfotech -Sumida’s New Power Inductors
    Date: June 5, 2024
    Keywords: Sumida Power Inductors
    Impacted Products: Power Inductors
    Manufacturers: Sumida America
    Summary: Sumida America introduces the CDPQ/T150 series of SMD power inductors designed for high-current applications such as on-board chargers for electric vehicles. These inductors feature precision flat wire windings and large copper pads for enhanced current handling, magnetic shielding, and compliance with AEC-Q200.

    10. Source: Trendforce – New DDR6 Memory Standard
    Date: June 6, 2024
    Keywords:DDR6 Memory Standard
    Impacted Products: DDR6
    Manufacturers:
    Summary: The upcoming DDR6 memory standard will significantly improve current memory technology. The new standard is expected to be finalised in the second quarter of 2025, with products likely to appear in late 2025 or 2026.

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