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  • Ten Daily Electronic Common Sense-Section 15

    What are the steps for CAN to handle errors when an error occurs?

    1. Detect whether it is a local (Local) error or a remote (Global) error.
    2. Send an error flag (broadcast error status).
    3. When the error is local, send an error flag to cover the time domain, and send the error delimiter.
    4. All nodes discard the transmitted information.
    5. Each node counts errors.
    6. The information is automatically retransmitted.

    There is no higher-level message transfer after an error occurs because the message discarded in error is retransmitted after a maximum of 31-bit times.
    CAN nodes define 3 fault states: “Fault Active” state, “Fault Accepted” state, and “Bus Disconnected” state.

    What are the system-level design environments for Quartus II?

    The Quartus II system-level design environment includes SOPC Builder (programmable system-on-chip design environment), DSP Builder (embedded DSP design environment), and Software Builder (software development environment).

    What is a hardware system?

    The automotive single-chip hardware system is a single-chip microcomputer system with a microcontroller as the core device. The system does not appear on the car in the form of several components but assembles almost all the hardware on one printed circuit board, and then uses one. The metal casing is packaged, and some are designed to prevent moisture and shock.

    What are the different versions of the current Modelsim?

    ModelSim SE, ModelSim PE, ModelSim LE, and ModelSim OEM.

    What constitutes a pocket lab?

    Consists of an inexpensive pocket test board with an emulator debugger, USB cable, and laptop.

    What is the ripple current?

    A current whose magnitude changes with time and whose direction does not change is called a pulsating current.

    Brief description of PROFIBUS-DP?

    DP is an abbreviation for Decentralized Periphery.PROFIBUS-DP (referred to as DP) is mainly used for unit-level and field-level communication in manufacturing automation systems and is especially suitable for fast cyclic data exchange between PLC and field-level distributed I/O devices. As part of the PLC hardware configuration, distributed I/O (eg ET 200) is configured with STEP 7. With the GSD file supplied by the supplier, you can use STEP 7 to configure slave devices from other manufacturers into the network.

    What are the two main factors that cause resistance changes due to changes in ambient temperature?

    The two main factors causing the change in resistance due to changes in ambient temperature are: one is that the resistance wire of the strain gauge has a certain temperature coefficient; the other is that the linear expansion coefficient of the resistance wire material and the test material are different.

    What are the main characteristics of the US E-Magin 852×600 0LEDoS microdisplay chip?

    1. The spatial resolution of 852×RGB×600, and the frame rate is up to 85 frames.
    2. The display area is 12.78mm×9mm, and the display brightness is >70cd/m2.
    3. 3V, 4V, a 3V power supply, lower video display power consumption, typical dynamic video display power consumption 250mW.
    4. Support two interface input modes, RGB and SMTPE-170M digital video mode.
    5. 24-bit RGB color display.

    What issues should be considered for polymer substrate materials for OLEDs?

    1. It should have a transmittance of 95% or more in the visible light range.
    2. Physicochemical properties of the polymer, such as thermal UV stability, Young’s modulus, and the like.
    3. Improve the barrier properties of the polymer to harmful gases, the success rate of preparing the electrode on the polymer, and reduce the resistivity.


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